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 oH V SC AV ER OM AI SIO PL LA N IA BL S NT E
Features

Applications

Lead free versions available RoHS compliant (lead free version)* Low profile package Surface mount Very low forward voltage drop
Cellular phones PDAs Desktop PCs and notebooks Digital cameras MP3 players
*R
CD1607-B120 ~ B140L Schottky Barrier Rectifier Chip Diode
General Information
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Schottky Rectifier Diodes for rectification applications, in compact chip package 1607 (Mini-SMA) size format, which offer PCB real estate savings and are considerably smaller than competitive parts. The Schottky Rectifier Diodes offer a forward current of 1 A with a choice of repetitive peak reverse voltage of 20 V up to 40 V. Bourns(R) Chip Diodes conform to JEDEC standards, easy to handle on standard pick and place equipment and their flat configuration makes roll away much more difficult. Electrical Characteristics (@ TA = 25 C Unless Otherwise Noted) Parameter Symbol B120 B120L CD1607B140 B140L Unit
Forward Voltage (Max.) (If = 1 A) Typical Junction Capacitance* Reverse Current (Max.) at Rated VR)
VF CT IR
0.5 110 0.5
0.38 100 1.0
0.5 110 0.5
0.4 110 1.0
V pF mA
* Measured at 1.0 MHz and applied reverse voltage of 4.0 V DC.
Absolute Ratings (@ TA = 25 C Unless Otherwise Noted) Parameter Symbol B120 B120L CD1607B140 B140L Unit
Repetitive Peak Reverse Voltage Reverse Voltage Maximum RMS Voltage Avg. Forward Current Forward Current, Surge Peak (60 Hz, 1 cycle) Typical Thermal Resistance** Storage Temperature Junction Temperature
VRRM VR VRMS IO Isurge RJL TSTG TJ
20 20 14
20 20 14 1 30* 20 -55 to +150 -55 to +125 How To Order
40 40 28
40 40 28
V V V A A C/W C C
** Thermal resistance junction to lead. * Condition: 8.3 ms single half sine-wave superimposed on rate load (JEDEC method).
CD 1607 - B 1 20 L __
Common Code Chip Diode Package * 1607 = Mini-SMA Model B = Schottky Barrier Series Average Forward Current (Io) Code 1 = 1 A (Code x 1000 mA = Average Forward Current) Reverse Voltage (VR) Code 20 = 20 V 40 = 40 V Forward Voltage Suffix L = Low Forward Voltage Vf (CD1607-B120L, CD1607-B140L)
Terminations LF = 100 % Sn (lead free) Blank = Sn/Pb
Reliable Electronic Solutions
Asia-Pacific: Tel: +886-2 2562-4117 * Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 * Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 * Fax: +1-951 781-5700 www.bourns.com
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
CD1607-B120 ~ B140L Schottky Barrier Rectifier Chip Diode
Product Dimensions
A C
Recommended Pad Layout
A
B
B
D C
Dimension
F
A (Max.)
E
B (Min.) Mini-SMA 3.70 - 4.10 (0.146 - 0.161) 1.40 - 1.80 (0.055 - 0.071) 0.30 TYP. (0.012) 2.40 - 2.80 (0.094 - 0.110) 0.90 2 PLCS. TYP. (0.035) 1.40 - 1.60 (0.055 - 0.063) C (Min.)
Dimension A B C D E F
Mini-SMA 3.50 (0.138) 1.50 (0.059) 1.50 (0.059)
MM (INCHES)
DIMENSIONS:
Physical Specifications Case....................................................................1607 Molded plastic Polarity ..........................................Color band denotes cathode end Terminals..........................Solderable per MIL-STD-750, Method 206 Weight ......................................................Approximately 0.04 grams Typical Part Marking CD1607-B120 ..................................................................l2
DIMENSIONS:
MM (INCHES)
CD1607-B120L ................................................................L2 CD1607-B140 ..................................................................l4 CD1607-B140L ................................................................L4
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
CD1607-B120 ~ B140L Schottky Barrier Rectifier Chip Diode
Rating and Characteristic Curves: CD1607-B120 & CD1607-B140 Forward Characteristics
100
Reverse Characteristics
100
10
10
Reverse Current (mAmps)
Forward Current (Amps)
1
1
Tj=75 C
0.1
0.1
Tj=25 C
0.01 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0.01 0 20 40 60 80 100 120 140 160 180 200
Forward Voltage (Volts)
Percent of Rated Peak Reverse Voltage (%)
Derating Curve
1.25
Capacitance Between Terminals
1000 900 F = 1 MHz Ta = 25 C
1.00 Average Forward Current (Amps)
800 700 Capacitance (pF) Single Phase Half Wave 60 Hz Resistive or Inductive Load
0.75
600 500 400 300 200 100 0
0.50
0.25
0.00 25 50 75 100 125 150
0 Lead Temperature (C)
20
40
60 Reverse Voltage (Volts)
80
100
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
CD1607-B120 ~ B140L Schottky Barrier Rectifier Chip Diode
Rating and Characteristic Curves: CD1607-B120L & CD1607-B140L Forward Characteristics
100
Reverse Characteristics
100
CD1607-B120L 10 CD1607-B140L 10
Forward Current (Amps)
1
Reverse Current (mAmps)
1
Tj=75 C
0.1
0.1
Tj=25 C 0.01 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0.01 0 20 40 60 80 100 120 140 160 180 200
Forward Voltage (Volts)
Percent of Rated Peak Reverse Voltage (%)
Derating Curve
1.25
Capacitance Between Terminals
1000 900 F = 1 MHz Ta = 25 C
1.00 Average Forward Current (Amps)
800 700 Capacitance (pF) Single Phase Half Wave 60 Hz Resistive or Inductive Load
0.75
600 500 400 300
0.50
0.25
200 100 0 20 40 60 80 100 120 140 160 0 20 40 60 Reverse Voltage (Volts) 80 100
0.00
Lead Temperature (C)
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
CD1607-B120 ~ B140L Schottky Barrier Rectifier Chip Diode
Packaging Information
The product will be dispensed in Tape and Reel format (see diagram below).
P 0 P 1 E Index Hole 120 F W B D2 D1 D T
d
P Trailer
A Device
C Leader W1 Start DIMENSIONS: MM (INCHES)
End
....... ....... ....... ....... ....... ....... ....... .......
10 pitches (min.) 10 pitches (min.)
Direction of Feed
Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Symbol A B C d D D1 D2 E F P P0 P1 T W W1 -1607 1.90 0.10 (0.075 - 0.004) 4.30 0.10 (0.169 - 0.004) 1.80 0.10 (0.071 - 0.004) 1.55 0.05 (0.061 - 0.002) 178 (7.008) 80.0 MIN. (3.150) 13.0 0.20 (0.512 - 0.008) 1.75 0.10 (0.069 - 0.004)) 3.50 0.05 (0.138 - 0.002) 4.00 0.10 (0.157 - 0.004) 4.00 0.10 (0.157 - 0.004) 2.00 0.05 (0.079 - 0.002) 0.20 0.10 (0.008 - 0.004) 8.00 0.20 (0.315 - 0.008) 13.5 MAX. (0.531) 2,500
Item Carrier Width Carrier Length Carrier Depth Sprocket Hole Reel Outside Diameter Reel Inner Diameter Feed Hole Diameter Sprocket Hole Position Punch Hole Position Punch Hole Pitch Sprocket Hole Pitch Embossment Center Overall Tape Thickness Tape Width Reel Width Quantity per Reel
REV. 02/05 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.


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